Calculation of thermal conductivity of filled oligomeric compositions

被引：0
|
作者：
Barzilovich E.A. [1 ]
Ryutkyanen E.A. [2 ]
Sirotinkin N.V. [2 ]
机构：
[1] Special Design and Technological Bureau Technolog, pr. Sovetskii 33a, St. Petersburg
[2] St. Petersburg State Technological Institute (Technical University), pr. Moskovskii 26, St. Petersburg
来源：
Polymer Science Series D | 2016年 / 9卷 / 3期
关键词：
coefficient of thermal conductivity; filler; filling system; oligomeric compounds; polymeric compounds; silicon carbide; thermal conductivity; thermal conductivity calculation;
D O I：
10.1134/S1995421216030047
中图分类号：
学科分类号：
摘要：
Different models for the calculation of thermal conductivity of oligomeric compositions filled with a dispersed filler (silicon carbide) are studied. It is shown that the calculated values of thermal conductivity of oligomeric compositions with introduced dispersed filler provided by the van Krevelen model developed for the calculation of thermal conductivity of unfilled amorphous polymers with isolated regions of the crystalline phase are the closest to the experimental ones. © 2016, Pleiades Publishing, Ltd.
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收藏
页码：307 / 311
页数：4
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