Essential and Non-essential Work of Fracture of PI/SiO2 Hybrid Thin Films

被引：0

作者：

Z. D. Wang

J. J. Lu

机构：

[1] Beijing JiaoTong University,Institute of Engineering Mechanics

[2] Chinese Academy of Sciences,Institute of Mechanics

来源：

Applied Composite Materials | 2007年 / 14卷

关键词：

thin film; fracture; plane-stress condition; EWF; SEM; FE method;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Essential work of fracture (EWF) analysis is used to study the effect of the silica doping level on fracture toughness of polyimide/silica (PI/SiO2) hybrid films. By using double-edge-notched-tension (DENT) specimens with different ligament lengths, it seems that the introduction of silica additive can improve the specific essential work of fracture (we) of PI thin films, but the specific non-essential work of fracture (βwp) will decease significantly as the silica doping level increasing from 1 to 5 wt.%, and even lower than that of neat PI. The failure process of the fracture is investigated with online scanning electron microscope (SEM) observation and the parameters of non-essential work of fracture, β and wp, are calculated based on finite element (FE) method.

引用

页码：33 / 45

页数：12

共 30 条

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