Research Progress on the Effect of Third Components on the Microstructure and Properties of W-Cu Composites

被引:0
作者
Chenlong Wei
Qiang Wang
Zhaoshi Dong
Jun Wen
机构
[1] Anqing Normal University,School of Electronic Engineering and Intelligent Manufacturing
[2] Chinese Academy of Sciences,Key Laboratory of Materials Physics, Institute of Solid State Physics, HFIPS
来源
JOM | 2024年 / 76卷
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摘要
W-Cu composites have high electrical and thermal conductivity, good arc stability, and high strength and hardness. They can be used as electrical contact processing materials, electronic packaging materials, and high-temperature heat dissipation materials. Due to the ever-increasing higher requirements of industry for the properties of W-Cu composites, different third components can be added to W-Cu composites to meet the requirements of improving their different properties. This article reviews the latest research progress in improving the microstructure and properties of W-Cu composites by adding a third component. The method of modifying W-Cu composite materials by adding rare-earth elements, carbon group elements, and hard particles is introduced. Finally, the problems and development directions of adding the third component are discussed.
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页码:20 / 30
页数:10
相关论文
共 219 条
[1]  
Chapa J(2002)undefined J. Nucl. Mater. 303 131-undefined
[2]  
Reimanis I(2018)undefined J. Nucl. Mater. 498 468-undefined
[3]  
Tejado E(2012)undefined J. Nucl. Mater. 431 196-undefined
[4]  
Müller AV(2018)undefined J. Alloy. Compd. 743 383-undefined
[5]  
You JH(2012)undefined Mater. Des. 36 108-undefined
[6]  
Pastor JY(2019)undefined J. Alloys Compd. 785 965-undefined
[7]  
Liu R(2018)undefined J. Alloys Compd. 766 204-undefined
[8]  
Hao T(1996)undefined Mat. Sci. Eng. A. 214 174-undefined
[9]  
Wang K(1998)undefined Met. Powder Rep. 53 38-undefined
[10]  
Zhang T(1994)undefined Int. J. Powder. Metall. 30 91-undefined