A comparison of polymer substrates for photolithographic processing of flexible bioelectronics

被引:0
作者
Dustin Simon
Taylor Ware
Ryan Marcotte
Benjamin R. Lund
Dennis W. Smith
Matthew Di Prima
Robert L. Rennaker
Walter Voit
机构
[1] The University of Texas at Dallas,Department of Materials Science and Engineering
[2] The University of Texas at Dallas,Department of Mechanical Engineering
[3] The University of Texas at Dallas,Department of Electrical Engineering, MS: EC 33
[4] The University of Texas at Dallas,Department of Chemistry
[5] The University of Texas at Dallas,School of Brain and Behavioral Sciences, GR 41
[6] Food and Drug Administration,undefined
[7] CDRH/OSEL/DSFM,undefined
来源
Biomedical Microdevices | 2013年 / 15卷
关键词
Flexible electronics; Smart polymers; Neural interfaces;
D O I
暂无
中图分类号
学科分类号
摘要
Flexible bioelectronics encompass a new generation of sensing devices, in which controlled interactions with tissue enhance understanding of biological processes in vivo. However, the fabrication of such thin film electronics with photolithographic processes remains a challenge for many biocompatible polymers. Recently, two shape memory polymer (SMP) systems, based on acrylate and thiol-ene/acrylate networks, were designed as substrates for softening neural interfaces with glass transitions above body temperature (37 °C) such that the materials are stiff for insertion into soft tissue and soften through low moisture absorption in physiological conditions. These two substrates, acrylate and thiol-ene/acrylate SMPs, are compared to polyethylene naphthalate, polycarbonate, polyimide, and polydimethylsiloxane, which have been widely used in flexible electronics research and industry. These six substrates are compared via dynamic mechanical analysis (DMA), thermogravimetric analysis (TGA), and swelling studies. The integrity of gold and chromium/gold thin films on SMP substrates are evaluated with optical profilometry and electrical measurements as a function of processing temperature above, below and through the glass transition temperature. The effects of crosslink density, adhesion and cure stress are shown to play a critical role in the stability of these thin film materials, and a guide for the future design of responsive polymeric materials suitable for neural interfaces is proposed. Finally, neural interfaces fabricated on thiol-ene/acrylate substrates demonstrate long-term fidelity through both in vitro impedance spectroscopy and the recording of driven local field potentials for 8 weeks in the auditory cortex of laboratory rats.
引用
收藏
页码:925 / 939
页数:14
相关论文
共 50 条
[31]   Improved fatigue resistance in transfer-printed flexible circuits embedded in polymer substrates with low melting temperatures [J].
Chalklen, Thomas ;
Smith, Michael ;
Kar-Narayan, Sohini .
FLEXIBLE AND PRINTED ELECTRONICS, 2023, 8 (02)
[32]   Direct writing and electro-mechanical characterization of Ag micro-patterns on polymer substrates for flexible electronics [J].
Arango, Maria A. Torres ;
Cokeley, Anna M. ;
Beard, Jared J. ;
Sierros, Konstantinos A. .
THIN SOLID FILMS, 2015, 596 :167-173
[33]   Focused ion beam milling for the fabrication of 160 nm channel length IGZO TFTs on flexible polymer substrates [J].
Munzenrieder, Niko ;
Shorubalko, Ivan ;
Petti, Luisa ;
Cantarella, Giuseppe ;
Shkodra, Bajramshahe ;
Meister, Tilo ;
Ishida, Koichi ;
Carta, Corrado ;
Ellinger, Frank ;
Troster, Gerhard .
FLEXIBLE AND PRINTED ELECTRONICS, 2020, 5 (01)
[34]   Flexible Polymeric Substrates for Electronic Applications [J].
Malik, Ankit ;
Kandasubramanian, Balasubramanian .
POLYMER REVIEWS, 2018, 58 (04) :630-667
[35]   Complementary Inverter Circuits on Flexible Substrates [J].
Reker, Julia ;
Meyers, Thorsten ;
Vidor, Fabio F. ;
Joubert, Trudi-Heleen ;
Hilleringmann, Ulrich .
2021 SMART SYSTEMS INTEGRATION (SSI), 2021,
[36]   Designing and manufacturing substrates for flexible electronics [J].
MacDonald, W. A. ;
Looney, M. K. ;
MacKerron, D. ;
Eveson, R. ;
Rakos, K. .
PLASTICS RUBBER AND COMPOSITES, 2008, 37 (2-4) :41-45
[37]   Flexible Si BiCMOS on Plastic Substrates [J].
Seo, Jung-Hun ;
Zhang, Kan ;
Zhou, Weidong ;
Ma, Zhenqiang .
2017 IEEE 17TH TOPICAL MEETING ON SILICON MONOLITHIC INTEGRATED CIRCUITS IN RF SYSTEMS (SIRF), 2017, :79-81
[38]   Latest advances in substrates for flexible electronics [J].
MacDonald, W. A. ;
Looney, M. K. ;
MacKerron, D. ;
Eveson, R. ;
Adam, R. ;
Hashimoto, K. ;
Rakos, K. .
JOURNAL OF THE SOCIETY FOR INFORMATION DISPLAY, 2007, 15 (12) :1075-1083
[39]   Large-Area Uniform Polymer Transistor Arrays on Flexible Substrates: Towards High-Throughput Sensor Fabrication [J].
Zeidell, Andrew M. ;
Filston, David S. ;
Waldrip, Matthew ;
Iqbal, Hamna F. ;
Chen, Hu ;
McCulloch, Iain ;
Jurchescu, Oana D. .
ADVANCED MATERIALS TECHNOLOGIES, 2020, 5 (08)
[40]   Fabrication of Conductive Copper Films on Flexible Polymer Substrates by Low-Temperature Sintering of Composite Cu Ink in Air [J].
Kanzaki, Mai ;
Kawaguchi, Yuki ;
Kawasaki, Hideya .
ACS APPLIED MATERIALS & INTERFACES, 2017, 9 (24) :20852-20858