Low-defect-density WS2 by hydroxide vapor phase deposition

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作者
Yi Wan
En Li
Zhihao Yu
Jing-Kai Huang
Ming-Yang Li
Ang-Sheng Chou
Yi-Te Lee
Chien-Ju Lee
Hung-Chang Hsu
Qin Zhan
Areej Aljarb
Jui-Han Fu
Shao-Pin Chiu
Xinran Wang
Juhn-Jong Lin
Ya-Ping Chiu
Wen-Hao Chang
Han Wang
Yumeng Shi
Nian Lin
Yingchun Cheng
Vincent Tung
Lain-Jong Li
机构
[1] King Abdullah University of Science and Technology (KAUST),Physical Sciences and Engineering Division
[2] The University of Hong Kong,Department of Mechanical Engineering
[3] The Hong Kong University of Science and Technology,Department of Physics
[4] Taiwan Semiconductor Manufacturing Company (TSMC),Corporate Research
[5] Nanjing University,National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures
[6] University of New South Wales,School of Materials Science and Engineering
[7] National Yang Ming Chiao Tung University,Department of Electrophysics
[8] National Taiwan University,Department of Physics
[9] Nanjing Tech University,Key Laboratory of Flexible Electronics & Institute of Advanced Materials
[10] King Abdulaziz University (KAAU),Department of Physics
[11] The University of Tokyo,Department of Chemical System and Engineering, School of Engineering
[12] Academia Sinica,Research Center for Applied Sciences
[13] Shenzhen University,School of Electronics and Information Engineering
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摘要
Two-dimensional (2D) semiconducting monolayers such as transition metal dichalcogenides (TMDs) are promising channel materials to extend Moore’s Law in advanced electronics. Synthetic TMD layers from chemical vapor deposition (CVD) are scalable for fabrication but notorious for their high defect densities. Therefore, innovative endeavors on growth reaction to enhance their quality are urgently needed. Here, we report that the hydroxide W species, an extremely pure vapor phase metal precursor form, is very efficient for sulfurization, leading to about one order of magnitude lower defect density compared to those from conventional CVD methods. The field-effect transistor (FET) devices based on the proposed growth reach a peak electron mobility ~200 cm2/Vs (~800 cm2/Vs) at room temperature (15 K), comparable to those from exfoliated flakes. The FET device with a channel length of 100 nm displays a high on-state current of ~400 µA/µm, encouraging the industrialization of 2D materials.
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