Interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films

被引：0
|
作者：
T. L. Su
L. C. Tsao
S. Y. Chang
T. H. Chuang
机构：
[1] National Taiwan University,Department of Materials Science and Engineering
来源：
Journal of Materials Engineering and Performance | 2002年 / 11卷
关键词：
Ag dissolution; Ag; Sn intermetallic compound; Ag thick film; Sn/Ag; Sn-3.5Ag/Ag; soldering reactions;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
The interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films are investigated in the temperature range from 250–325 °C, and the morphology of intermetallic compounds formed after such soldering reactions is observed. In kinetics analysis of the growths of intermetallic compounds, it was found that both Sn/Ag and Sn-3.5Ag/Ag reactions were interfacial-controlled, and the growth rates for both cases were similar. The rate of Ag dissolution into liquid solder attendant on the formation of interfacial intermetallic compounds after Sn/Ag reaction was about four times higher than that after Sn-3.5Ag/Ag reaction, as evidenced by experimental results.
引用
收藏
页码：481 / 486
页数：5
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