Au-Sn SLID Bonding—Properties and Possibilities

被引：0
|
作者：
Torleif A. Tollefsen
Andreas Larsson
Ole Martin Løvvik
Knut Aasmundtveit
机构：
[1] SINTEF ICT Instrumentation,Institute for Micro and Nanosystems Technology
[2] Vestfold University College,Department of Physics
[3] SINTEF Materials and Chemistry,undefined
[4] University of Oslo,undefined
来源：
Metallurgical and Materials Transactions B | 2012年 / 43卷
关键词：
AuSn Phase; Liquid Interdiffusion; Eutectic AuSn; Fluxless Bonding;
D O I：
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中图分类号：
学科分类号：
摘要：
Au-Sn solid–liquid interdiffusion (SLID) bonding is a novel and promising interconnect technology for high-temperature applications. This article gives a review over previously published work on Au-Sn SLID bonding. An overview of the crystal phases and the thermomechanical properties of the Au-Sn phases relevant for Au-Sn SLID bonding is given. A summary of the bonding conditions used during Au-Sn SLID bonding is presented together with results from reliability tests. Additional challenges, possibilities, and recommendations for how a reliable high-temperature Au-Sn SLID bonding should be constructed are also discussed.
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页码：397 / 405
页数：8
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