Direct bonding with on-wafer metal interconnections

被引：0
作者：
C. Jia
M. Wiemer
T. Gessner
机构：
[1] Fraunhofer Institute of Reliability and Micro Integration,Department of Micro Devices and Equipment
[2] Chemnitz University of Technology,Center for Microtechnologies
来源：
Microsystem Technologies | 2006年 / 12卷
关键词：
Chemical Mechanical Polishing; Plasma Enhance Chemical Vapor Deposition; Direct Bonding; Micro Electro Mechanical System; Glass Wafer;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
A low temperature direct bonding process with encapsulated metal interconnections was proposed. The process can be realized between silicon wafers or silicon and glass wafers. To establish well-insulated electric connection, sputtered aluminum film was patterned between a bottom thermal SiO2 and a top PE-SiO2; the consequential uneven wafer surface was planarized through a chemical mechanical polishing (CMP) step. Benefit from this smooth surface finish, direct bonding is achieved at room temperature, and a general yielding rate of more than 95% is obtained. Test results confirmed the reliability of the bonding. The main advantages of this new technology are its electric connectivity, low thermal stress and hermeticity. This process can be utilized for the packaging of micro electro mechanical system (MEMS) devices or the production of SOI wafers with pre-fabricated electrodes and wires.
引用
收藏
页码：391 / 396
页数：5
相关论文
共 27 条
[1]  
Shimbo M(1986)Silicon-to-silicon direct bonding method J Appl Phys 60 2987-2989
[2]  
Furukawa K(1998)Wafer-to-wafer bonding for microstructure formation Proc IEEE 86 1575-1585
[3]  
Fukuda K(1998)Bulk micromachining of silicon Proc IEEE 86 1536-1551
[4]  
Tanzawa K(1998)Low-temperature direct bonding of silicon and silicon dioxide by the surface activation method Sensors Actuators A 70 164-170
[5]  
Schmidt MA(1995)Characterization of the electrostatic bonding of silicon and Pyrex glass J Micromech Microeng 5 98-102
[6]  
Kovacs GTA(2000)An improved anodic bonding process using pulsed voltage techniques J MEMS 9 469-473
[7]  
Maluf NI(1994)Low-temperature silicon wafer-to-wafer bonding using gold at eutectic temperature Sensors Actuators A 43 223-229
[8]  
Petersen KE(2002)A low-temperature bonding technique using spin-on fluorocarbon polymers to assemble microsystems J Micromech Microeng 12 187-191
[9]  
Takagi H(2001)Low-temperature wafer-level transfer bonding J MEMS 10 525-531
[10]  
Maeda R(2001)A hermetic glass–silicon package formed using localized aluminum/silicon–glass bonding J MEMS 10 392-399
123