The application of thick-film technology in C-MEMS

被引:0
作者
Darko Belavic
Marko Hrovat
Janez Holc
Marina Santo Zarnik
Marija Kosec
Marko Pavlin
机构
[1] HIPOT-R&D and HYB,
[2] “Jožef Stefan” Institute,undefined
来源
Journal of Electroceramics | 2007年 / 19卷
关键词
Thick-film; LTCC substrate; Ceramic MEMS; Sensors; Actuators;
D O I
暂无
中图分类号
学科分类号
摘要
Laminated 3D structures made using low-temperature co-fired ceramic (LTCC) technology are practical for ceramic micro-electro-mechanical systems (C-MEMS). The sensors for mechanical quantities, and/or actuators, are fundamental parts of MEMS. Thick-film resistors can be used to sense the mechanical deformations, and thick-film piezoelectric materials can be used as electro-mechanical transducers in a C-MEMS structure. The integration of these thick-film materials on LTCC substrates is in some cases difficult to realise due to interactions with the rather glassy LTCC substrates. The subject of our work is an investigation of thick-film materials for electro-mechanical transducers (sensors and actuators) and their compatibility with LTCC substrates. Resistors made with commercial thick-film resistor materials for use as sensors on LTCC substrates have been investigated and evaluated. Ferroelectric ceramic materials based on solid solutions of lead zirconate titanate (PZT) with low firing temperatures around 850°C were developed for thick-film technology and evaluated on LTCC substrates.
引用
收藏
页码:363 / 368
页数:5
相关论文
共 62 条
  • [1] Belavič D.(1997)Low-cost force sensor for an electronic scale Inf. MIDEM 27 172-176
  • [2] Šoba S.(1994)Sensors: a great chance for microelectronic technologies Inf. MIDEM 24 248-257
  • [3] Hodnik M.(1997)Thick film sensors: past, present and future Meas. Sci. Technol. 8 1-20
  • [4] Pavlin M.(2003)Thick-film technology for sensor applications Inf. MIDEM 33 45-48
  • [5] Gramc S.(2002)Using LTCC for microsystems Microelectron. Int. 19 19-23
  • [6] Hrovat M.(2002)LTCC in microsystem application Inf. MIDEM 32 272-279
  • [7] Del’Acqua R.(2000)Interactions between ruthenium-based resistors and cordierite-glass substrates in low temperature co-fired ceramics J. Am. Ceram. Soc. 83 2945-2953
  • [8] White N.M.(1997)Camber development during cofiring Ag-based low-dielectric-constant ceramic package J. Mater. Res. 12 2743-2750
  • [9] Turner J.D.(2003)Critical behaviour of the piezoresistive response in RuO2-glass composites J. Phys. D: Appl. Phys. 36 1341-1348
  • [10] Belavič D.(1994)An evaluation of some commercial thick film resistors for strain gauges J. Mater. Sci. Lett. 13 992-995