Enhanced shear strength and microstructure of Cu-Cu interconnection by low-temperature sintering of Cu nanoparticles

被引：3

作者：

Cui, Ze ^{[1
]}

Jia, Qiang ^{[1
]}

Wang, Yishu ^{[1
]}

Li, Dan ^{[1
]}

Wang, Chien-Ping ^{[2
]}

Zhang, Hongqiang ^{[3
]}

Lu, Ziyi ^{[1
]}

Ma, Limin ^{[1
]}

Zou, Guisheng ^{[4
]}

Guo, Fu ^{[1
,5
]}

机构：

[1] Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China

[2] Natl Taipei Univ Technol, Dept Mech Engn, Taipei, Taiwan

[3] Beihang Univ, Sch Mech Engn & Automat, Beijing 100191, Peoples R China

[4] Tsinghua Univ, Dept Mech Engn, State Key Lab Tribol, Beijing 100084, Peoples R China

[5] Beijing Informat Sci & Technol Univ, Sch Mech Elect Engn, Beijing 100192, Peoples R China

来源：

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2024年 / 35卷 / 11期

关键词：

NANO-SILVER JOINTS; BONDING STRENGTH; PARTICLES; AG; EVOLUTION; FRACTURE; AIR;

D O I：

10.1007/s10854-024-12492-w

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Sintering of Cu nanoparticles at low temperature is a promising material for advanced power electronic packaging; while its sintering quality is significantly inhibited by oxides. In this work, the Pt-catalyzed formic acid and decomposition of mixtures of organic compounds and copper formate were utilized to eliminate Cu nanoparticles from oxidation to promote Cu atomic diffusion and form strong bonding. The results indicated that the sintered neck length was longer in the Pt-catalyzed formic acid environment, and the stronger atomic diffusion and interparticle bonding was formed. The shear strength of the sintered Cu-Cu joint reached 49 MPa at 180 degrees C. Furthermore, the effects of temperature and pressure on the formation and growth of sintered necks, pore eliminations, densification, and bonding strength were discussed. This work could provide industrial insights from realizing low-temperature sintering used in the field of power electronics.

引用

页数：13

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