KrF excimer laser dry and steam cleaning of silicon surfaces with metallic particulate contaminants

被引：0

作者：

P. Neves

M. Arronte

R. Vilar

A.M. Botelho do Rego

机构：

[1] Departamento de Engenharia de Materiais,

[2] Instituto Superior Tecnico,undefined

[3] 1049-001 Lisboa,undefined

[4] Portugal (Fax: +351-218418120,undefined

[5] E-mail: pedrojnn@popsrv.ist.utl.pt; arronte@ist.utl.pt; rui.vilar@ist.utl.pt),undefined

[6] Centro de Química-Física Molecular,undefined

[7] Complexo Interdisciplinar,undefined

[8] Instituto Superior Tecnico,undefined

[9] 1049-001 Lisboa,undefined

[10] Portugal (Fax: +351-218419255,undefined

[11] E-mail: amrego@ist.utl.pt),undefined

来源：

Applied Physics A | 2002年 / 74卷

关键词：

PACS: 81.65.Cf; 79.60.Bm;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

KrF excimer laser-assisted dry and steam cleaning of single-crystal silicon wafers contaminated with three different types of metallic particles was studied. The laser fluence used was 0.3 J/cm2. In the dry process, for samples cleaned with 100 laser pulses the cleaning efficiency was 91, 71 and 59% for Au, Cu and W particles, respectively, whilst in steam cleaning the efficiency is about 100% after 5 laser pulses, independently of the type of contaminant.

引用

页码：191 / 199

页数：8