Acoustics and atomic force microscopy for the mechanical characterization of thin films

被引:0
作者
Daniele Passeri
Andrea Bettucci
Marco Rossi
机构
[1] University of Rome “La Sapienza”,Department of Energetics
[2] Consorzio Nazionale Interuniversitario per le Scienze Fisiche della Materia (CNISM),undefined
来源
Analytical and Bioanalytical Chemistry | 2010年 / 396卷
关键词
Atomic force microscopy; Thin film; Interface/surface analysis; Ultrasonics; Mechanical properties;
D O I
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中图分类号
学科分类号
摘要
The science and technology of thin films require the development of nondestructive methods for their quantitative mechanical characterization with nanometric spatial resolution. High-frequency ultrasonic techniques—especially acoustic microscopy—and atomic force microscopy (AFM) have been demonstrated to represent versatile tools for developing such methods. In particular, in the last 15 years, the combination of AFM, which can probe the surface of a sample by applying ultralow loads (from micronewtons down to piconewtons) with a micromachined tip having an apex radius of a few nanometers, and ultrasonics techniques led researchers to develop some unique tools which allow one to perform not only spot measurements of the sample elastic modulus, but also to obtain both the qualitative imaging of mechanical properties and the quantitative mapping of the elastic modulus of the sample surface with nanometric lateral resolution. In the present review, firstly a brief overview of the main ultrasound-based techniques for thin film characterization is reported. Then, some of the ultrasonic AFM techniques are described, emphasizing their capability of retrieving maps of both the tip–sample contact stiffness and the sample elastic modulus. Although these techniques are less affected by the mechanical properties of the substrates than standard indentation tests, a method for the correction of the substrate effect in ultrathin films is reported in detail. Finally, by probing the mechanical properties of a small portion of the sample volume underneath the tip, we illustrate the techniques as tools for the qualitative and quantitative characterization of variations in the adhesion between a thin film and a buried interface, as well as for detecting subsurface defects, voids, cracks, and dislocations.
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页码:2769 / 2783
页数:14
相关论文
共 321 条
[41]  
Bhushan B(1987)undefined Int J Solids Struct 23 1657-undefined
[42]  
Li X(1988)undefined Int J Solids Struct 24 1287-undefined
[43]  
Lin KH(1992)undefined Int J Solids Struct 29 2471-undefined
[44]  
Hurley DC(2004)undefined J Mater Res 19 3076-undefined
[45]  
Tewary VK(2005)undefined Appl Surf Sci 252 1915-undefined
[46]  
Richards AJ(1991)undefined Nanotechnology 2 103-undefined
[47]  
Wu TT(1996)undefined Thin Solid Films 273 143-undefined
[48]  
Chen YY(1999)undefined Tribol Lett 7 199-undefined
[49]  
Huang GT(2005)undefined Science 310 61-undefined
[50]  
Chang PZ(2005)undefined Science 310 89-undefined