共 50 条
- [42] Cu segregation at the Al(Cu)Al2O3 interface APPLIED PHYSICS LETTERS, 1996, 68 (12) : 1625 - 1627
- [43] The Study of the Growth Behavior of Cu6Sn5 at the Sn/Cu Interface during the Heating Preservation Stage 2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2016, : 327 - 330
- [44] KINETICS OF MICROVOID HEALING DURING ISOTHERMAL HEATING. Physics of Metals and Metallography, 1984, 57 (05): : 90 - 95
- [46] Initial hillock formation and changes in overall stress in Al–Cu films and pure Al films during heating Journal of Materials Research, 1999, 14 : 4087 - 4092
- [47] EBSD Investigation of Cu-Sn IMC Microstructural Evolution in Cu/Sn-Ag/Cu Microbumps During Isothermal Annealing Journal of Electronic Materials, 2014, 43 : 219 - 228