Solid damping in micro electro mechanical systems

被引：0
作者：
Raffaele Ardito
Claudia Comi
Alberto Corigliano
Attilio Frangi
机构：
[1] Politecnico di Milano,Dipartimento di Ingegneria Strutturale
来源：
Meccanica | 2008年 / 43卷
关键词：
Microelectromechanical systems; Damping; Mechanical dissipation; Thermoelasticity; Nonlocal model;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
This paper focuses on the problem of the numerical evaluation of dissipation induced by thermoelastic coupling in microelectromechanical systems. An ad hoc conceived, FE based, numerical procedure for the evaluation of the thermoelastic dissipation is proposed and the numerical results are compared with analytical solutions. In order to introduce in the numerical response a dependence on the size of the resonating devices, which is experimentally observed at very small dimensions, a new enhanced non-local coupled thermoelastic model is proposed and the first results are discussed.
引用
收藏
页码：419 / 428
页数：9
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