Co-packaged optics (CPO): status, challenges, and solutions

被引：0

作者：

Min Tan

Jiang Xu

Siyang Liu

Junbo Feng

Hua Zhang

Chaonan Yao

Shixi Chen

Hangyu Guo

Gengshi Han

Zhanhao Wen

Bao Chen

Yu He

Xuqiang Zheng

Da Ming

Yaowen Tu

Qiang Fu

Nan Qi

Dan Li

Li Geng

Song Wen

Fenghe Yang

Huimin He

Fengman Liu

Haiyun Xue

Yuhang Wang

Ciyuan Qiu

Guangcan Mi

Yanbo Li

Tianhai Chang

Mingche Lai

Luo Zhang

Qinfen Hao

Mengyuan Qin

机构：

[1] Huazhong University of Science and Technology,School of Optical and Electronic Information

[2] Huazhong University of Science and Technology,Wuhan National Laboratory for Optoelectronics

[3] The Hong Kong University of Science and Technology,Department of Electronic and Computer Engineering

[4] HKUST Fok Ying Tung Research Institute,Institute of Microelectronics

[5] The Hong Kong University of Science and Technology (Guangzhou),State Key Laboratory of Superlattices and Microstructures, Institute of Semiconductors

[6] Chongqing United Micro-Electronics Center (CUMEC),School of Microelectronics

[7] Hisense Broadband Multimedia Technologies Co.,The State Key Laboratory of Advanced Optical Communication Systems and Networks, Department of Electronic Engineering

[8] Ltd.,College of Computer

[9] Chinese Academy of Sciences,Institute of Computing Technology

[10] Chinese Academy of Sciences,undefined

[11] Xi’an Jiaotong University,undefined

[12] Zhangjiang Laboratory,undefined

[13] Shanghai Jiao Tong University,undefined

[14] Huawei Technologies Co.,undefined

[15] Ltd.,undefined

[16] National University of Defense Technology,undefined

[17] Chinese Academy of Sciences,undefined

来源：

Frontiers of Optoelectronics | / 16卷

关键词：

Co-packaged optics; Silicon photonics; High-performance computing; Advanced packaging; External laser; Optical power delivery; Co-simulation; Standardization; Transmitter; Receiver;

D O I：

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中图分类号：

学科分类号：

摘要：

引用

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[31] Scalable Fabrication of 3D Optical Re-distribution for Co-Packaged Optics using an Developed Nanoimprint Stepper [J].

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