Co-packaged optics (CPO): status, challenges, and solutions

被引：0
作者：
Min Tan
Jiang Xu
Siyang Liu
Junbo Feng
Hua Zhang
Chaonan Yao
Shixi Chen
Hangyu Guo
Gengshi Han
Zhanhao Wen
Bao Chen
Yu He
Xuqiang Zheng
Da Ming
Yaowen Tu
Qiang Fu
Nan Qi
Dan Li
Li Geng
Song Wen
Fenghe Yang
Huimin He
Fengman Liu
Haiyun Xue
Yuhang Wang
Ciyuan Qiu
Guangcan Mi
Yanbo Li
Tianhai Chang
Mingche Lai
Luo Zhang
Qinfen Hao
Mengyuan Qin
机构：
[1] Huazhong University of Science and Technology,School of Optical and Electronic Information
[2] Huazhong University of Science and Technology,Wuhan National Laboratory for Optoelectronics
[3] The Hong Kong University of Science and Technology,Department of Electronic and Computer Engineering
[4] HKUST Fok Ying Tung Research Institute,Institute of Microelectronics
[5] The Hong Kong University of Science and Technology (Guangzhou),State Key Laboratory of Superlattices and Microstructures, Institute of Semiconductors
[6] Chongqing United Micro-Electronics Center (CUMEC),School of Microelectronics
[7] Hisense Broadband Multimedia Technologies Co.,The State Key Laboratory of Advanced Optical Communication Systems and Networks, Department of Electronic Engineering
[8] Ltd.,College of Computer
[9] Chinese Academy of Sciences,Institute of Computing Technology
[10] Chinese Academy of Sciences,undefined
[11] Xi’an Jiaotong University,undefined
[12] Zhangjiang Laboratory,undefined
[13] Shanghai Jiao Tong University,undefined
[14] Huawei Technologies Co.,undefined
[15] Ltd.,undefined
[16] National University of Defense Technology,undefined
[17] Chinese Academy of Sciences,undefined
来源：
Frontiers of Optoelectronics | / 16卷
关键词：
Co-packaged optics; Silicon photonics; High-performance computing; Advanced packaging; External laser; Optical power delivery; Co-simulation; Standardization; Transmitter; Receiver;
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