Interfacial thermal contact resistance between aluminum nitride and copper at cryogenic temperature

被引：0
作者：
Ling Shi
Gang Wu
Hui-ling Wang
Xin-ming Yu
机构：
[1] Jianghan University,School of Chemistry and Environment Engineering
[2] Naval University of Engineering,Department of Mechanical Engineering
[3] Huazhong University of Science and Technology,The Institute of Energy and Power
来源：
Heat and Mass Transfer | 2012年 / 48卷
关键词：
Contact Pressure; Aluminum Nitride; Thermal Contact Resistance; Interface Thermal Resistance; Specific Heat Data;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
The purpose of this study was to investigate the interfacial thermal contact resistance (ITCR) between aluminum nitride and copper. The ITCR was measured based on one-dimension steady-state heat conduction over a temperature range of 90–210 K and over a contact pressure range of 0.3–1.0 MPa. Our results show that the ITCR between aluminum nitride and copper decreases with increasing contact pressure, and increasing interfacial temperature. An ITCR model, which the influence of the surface layer on the ITCR is considered, is presented for prediction the ITCR.
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页码：999 / 1004
页数：5
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