Thermoelectric Cooling of Heat-Loaded Electronics

被引:0
作者
Vasil’ev E.N. [1 ]
机构
[1] Institute of Computational Modeling, Siberian Branch, Russian Academy of Sciences, Akademgorodok, Krasnoyarsk
基金
俄罗斯基础研究基金会;
关键词
Electronic cooling - Energy efficiency - Thermoelectric equipment - Thermoelectricity - Cooling systems - Heat flux;
D O I
10.1134/S1063739720020092
中图分类号
学科分类号
摘要
Abstract: The characteristics of cooling and thermal control systems are calculated depending on the parameters of the thermoelectric module and the heat-loaded element. The values of the temperature difference in the heat distributor for a thermoelectric module with dimensions 30 × 30 mm2 and 40 × 40 mm2 are determined. The significant effect of the inhomogeneity of the heat flux and the temperature field of the surface of the thermoelectric module on the value of the temperature difference in the heat distributor is established. The cooling efficiency and power consumption for different cooling capacities are compared taking into account the influence of the thermal resistance of the heat-removal system. The parameters and factors affecting the choice of thermoelectric module and cooling modes are analyzed. © 2020, Pleiades Publishing, Ltd.
引用
收藏
页码:123 / 131
页数:8
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