机构:Princeton University,Department of Electrical Engineering and Princeton Institute for the Science and Technology of Materials
Sigurd Wagner
Siegfried Bauer
论文数: 0引用数: 0
h-index: 0
机构:Princeton University,Department of Electrical Engineering and Princeton Institute for the Science and Technology of Materials
Siegfried Bauer
机构:
[1] Princeton University,Department of Electrical Engineering and Princeton Institute for the Science and Technology of Materials
[2] Johannes Kepler University,Department of Soft Matter Physics
来源:
MRS Bulletin
|
2012年
/
37卷
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摘要:
Electronics can be made on elastically stretchable “skin.” Such skins conform to irregularly curved surfaces and carry arrays of thin-film devices and integrated circuits. Laypeople and scientists intuitively grasp the concept of electronic skins; material scientists then ask “what materials are used?” and “how does it work?” Stretchable circuits are made of diverse materials that span more than 12 orders of magnitude in elastic modulus. We begin with a brief overview of the materials and the architecture of stretchable electronics, then we discuss stretchable substrates, encapsulation, interconnects, and the fabrication of devices and circuits. These components and techniques provide the tools for creating new concepts in biocompatible circuits that conform to and stretch with living tissue. They enable wireless energy transfer via stretchable antennas, stretchable solar cells that convert sunlight to electricity, supercapacitors, and batteries that store energy in stretchable electronic devices. We conclude with a brief outlook on the technical challenges for this revolutionary technology on its road to functional stretchable electronic systems.
机构:
Elect & Telecommun Res Inst, Smart I O Platform Res Dept, Daejeon 305730, South KoreaElect & Telecommun Res Inst, Smart I O Platform Res Dept, Daejeon 305730, South Korea
Oh, Ji-Young
Kim, Joo Yeon
论文数: 0引用数: 0
h-index: 0
机构:
Elect & Telecommun Res Inst, Smart I O Platform Res Dept, Daejeon 305730, South KoreaElect & Telecommun Res Inst, Smart I O Platform Res Dept, Daejeon 305730, South Korea
Kim, Joo Yeon
Park, Chan Woo
论文数: 0引用数: 0
h-index: 0
机构:
Elect & Telecommun Res Inst, Smart I O Platform Res Dept, Daejeon 305730, South KoreaElect & Telecommun Res Inst, Smart I O Platform Res Dept, Daejeon 305730, South Korea
Park, Chan Woo
Jung, Soon Won
论文数: 0引用数: 0
h-index: 0
机构:
Elect & Telecommun Res Inst, Smart I O Platform Res Dept, Daejeon 305730, South KoreaElect & Telecommun Res Inst, Smart I O Platform Res Dept, Daejeon 305730, South Korea
Jung, Soon Won
Na, Bock Soon
论文数: 0引用数: 0
h-index: 0
机构:
Elect & Telecommun Res Inst, Smart I O Platform Res Dept, Daejeon 305730, South KoreaElect & Telecommun Res Inst, Smart I O Platform Res Dept, Daejeon 305730, South Korea
Na, Bock Soon
Lee, Keunsoo
论文数: 0引用数: 0
h-index: 0
机构:
Elect & Telecommun Res Inst, Smart I O Platform Res Dept, Daejeon 305730, South KoreaElect & Telecommun Res Inst, Smart I O Platform Res Dept, Daejeon 305730, South Korea
Lee, Keunsoo
Park, Nae-Man
论文数: 0引用数: 0
h-index: 0
机构:
Elect & Telecommun Res Inst, Smart I O Platform Res Dept, Daejeon 305730, South KoreaElect & Telecommun Res Inst, Smart I O Platform Res Dept, Daejeon 305730, South Korea
Park, Nae-Man
Lee, Sang Seok
论文数: 0引用数: 0
h-index: 0
机构:
Elect & Telecommun Res Inst, Smart I O Platform Res Dept, Daejeon 305730, South KoreaElect & Telecommun Res Inst, Smart I O Platform Res Dept, Daejeon 305730, South Korea
Lee, Sang Seok
Koo, Jae Bon
论文数: 0引用数: 0
h-index: 0
机构:
Elect & Telecommun Res Inst, Smart I O Platform Res Dept, Daejeon 305730, South KoreaElect & Telecommun Res Inst, Smart I O Platform Res Dept, Daejeon 305730, South Korea
Koo, Jae Bon
Hwang, Chi-Sun
论文数: 0引用数: 0
h-index: 0
机构:
Elect & Telecommun Res Inst, Smart I O Platform Res Dept, Daejeon 305730, South KoreaElect & Telecommun Res Inst, Smart I O Platform Res Dept, Daejeon 305730, South Korea
机构:
MIT, Dept Mech Engn, Soft Act Mat Lab, Cambridge, MA 02139 USAMIT, Dept Mech Engn, Soft Act Mat Lab, Cambridge, MA 02139 USA
Lin, Shaoting
Yuk, Hyunwoo
论文数: 0引用数: 0
h-index: 0
机构:
MIT, Dept Mech Engn, Soft Act Mat Lab, Cambridge, MA 02139 USAMIT, Dept Mech Engn, Soft Act Mat Lab, Cambridge, MA 02139 USA
Yuk, Hyunwoo
Zhang, Teng
论文数: 0引用数: 0
h-index: 0
机构:
MIT, Dept Mech Engn, Soft Act Mat Lab, Cambridge, MA 02139 USAMIT, Dept Mech Engn, Soft Act Mat Lab, Cambridge, MA 02139 USA
Zhang, Teng
Parada, German Alberto
论文数: 0引用数: 0
h-index: 0
机构:
MIT, Dept Mech Engn, Soft Act Mat Lab, Cambridge, MA 02139 USA
MIT, Dept Chem Engn, Cambridge, MA 02139 USAMIT, Dept Mech Engn, Soft Act Mat Lab, Cambridge, MA 02139 USA
Parada, German Alberto
Koo, Hyunwoo
论文数: 0引用数: 0
h-index: 0
机构:
MIT, Dept Mech Engn, Soft Act Mat Lab, Cambridge, MA 02139 USA
Samsung Display Res Inst, Yongin 446711, Gyeonggi Do, South KoreaMIT, Dept Mech Engn, Soft Act Mat Lab, Cambridge, MA 02139 USA
Koo, Hyunwoo
Yu, Cunjiang
论文数: 0引用数: 0
h-index: 0
机构:
Univ Houston, Dept Mech Engn, Houston, TX 77204 USAMIT, Dept Mech Engn, Soft Act Mat Lab, Cambridge, MA 02139 USA
Yu, Cunjiang
Zhao, Xuanhe
论文数: 0引用数: 0
h-index: 0
机构:
MIT, Dept Mech Engn, Soft Act Mat Lab, Cambridge, MA 02139 USA
MIT, Dept Civil & Environm Engn, Cambridge, MA 02139 USAMIT, Dept Mech Engn, Soft Act Mat Lab, Cambridge, MA 02139 USA
机构:
Penn State Univ, Ctr Neural Engn, Dept Engn Sci & Mech, University Pk, PA USAPenn State Univ, Ctr Neural Engn, Dept Engn Sci & Mech, University Pk, PA USA
Zhou, Tao
Yuk, Hyunwoo
论文数: 0引用数: 0
h-index: 0
机构:
SanaHeal Inc, Cambridge, MA 02139 USAPenn State Univ, Ctr Neural Engn, Dept Engn Sci & Mech, University Pk, PA USA
机构:
Elect & Telecommun Res Inst, Smart I O Platform Res Dept, Daejeon 305730, South KoreaElect & Telecommun Res Inst, Smart I O Platform Res Dept, Daejeon 305730, South Korea
Oh, Ji-Young
Kim, Joo Yeon
论文数: 0引用数: 0
h-index: 0
机构:
Elect & Telecommun Res Inst, Smart I O Platform Res Dept, Daejeon 305730, South KoreaElect & Telecommun Res Inst, Smart I O Platform Res Dept, Daejeon 305730, South Korea
Kim, Joo Yeon
Park, Chan Woo
论文数: 0引用数: 0
h-index: 0
机构:
Elect & Telecommun Res Inst, Smart I O Platform Res Dept, Daejeon 305730, South KoreaElect & Telecommun Res Inst, Smart I O Platform Res Dept, Daejeon 305730, South Korea
Park, Chan Woo
Jung, Soon Won
论文数: 0引用数: 0
h-index: 0
机构:
Elect & Telecommun Res Inst, Smart I O Platform Res Dept, Daejeon 305730, South KoreaElect & Telecommun Res Inst, Smart I O Platform Res Dept, Daejeon 305730, South Korea
Jung, Soon Won
Na, Bock Soon
论文数: 0引用数: 0
h-index: 0
机构:
Elect & Telecommun Res Inst, Smart I O Platform Res Dept, Daejeon 305730, South KoreaElect & Telecommun Res Inst, Smart I O Platform Res Dept, Daejeon 305730, South Korea
Na, Bock Soon
Lee, Keunsoo
论文数: 0引用数: 0
h-index: 0
机构:
Elect & Telecommun Res Inst, Smart I O Platform Res Dept, Daejeon 305730, South KoreaElect & Telecommun Res Inst, Smart I O Platform Res Dept, Daejeon 305730, South Korea
Lee, Keunsoo
Park, Nae-Man
论文数: 0引用数: 0
h-index: 0
机构:
Elect & Telecommun Res Inst, Smart I O Platform Res Dept, Daejeon 305730, South KoreaElect & Telecommun Res Inst, Smart I O Platform Res Dept, Daejeon 305730, South Korea
Park, Nae-Man
Lee, Sang Seok
论文数: 0引用数: 0
h-index: 0
机构:
Elect & Telecommun Res Inst, Smart I O Platform Res Dept, Daejeon 305730, South KoreaElect & Telecommun Res Inst, Smart I O Platform Res Dept, Daejeon 305730, South Korea
Lee, Sang Seok
Koo, Jae Bon
论文数: 0引用数: 0
h-index: 0
机构:
Elect & Telecommun Res Inst, Smart I O Platform Res Dept, Daejeon 305730, South KoreaElect & Telecommun Res Inst, Smart I O Platform Res Dept, Daejeon 305730, South Korea
Koo, Jae Bon
Hwang, Chi-Sun
论文数: 0引用数: 0
h-index: 0
机构:
Elect & Telecommun Res Inst, Smart I O Platform Res Dept, Daejeon 305730, South KoreaElect & Telecommun Res Inst, Smart I O Platform Res Dept, Daejeon 305730, South Korea
机构:
MIT, Dept Mech Engn, Soft Act Mat Lab, Cambridge, MA 02139 USAMIT, Dept Mech Engn, Soft Act Mat Lab, Cambridge, MA 02139 USA
Lin, Shaoting
Yuk, Hyunwoo
论文数: 0引用数: 0
h-index: 0
机构:
MIT, Dept Mech Engn, Soft Act Mat Lab, Cambridge, MA 02139 USAMIT, Dept Mech Engn, Soft Act Mat Lab, Cambridge, MA 02139 USA
Yuk, Hyunwoo
Zhang, Teng
论文数: 0引用数: 0
h-index: 0
机构:
MIT, Dept Mech Engn, Soft Act Mat Lab, Cambridge, MA 02139 USAMIT, Dept Mech Engn, Soft Act Mat Lab, Cambridge, MA 02139 USA
Zhang, Teng
Parada, German Alberto
论文数: 0引用数: 0
h-index: 0
机构:
MIT, Dept Mech Engn, Soft Act Mat Lab, Cambridge, MA 02139 USA
MIT, Dept Chem Engn, Cambridge, MA 02139 USAMIT, Dept Mech Engn, Soft Act Mat Lab, Cambridge, MA 02139 USA
Parada, German Alberto
Koo, Hyunwoo
论文数: 0引用数: 0
h-index: 0
机构:
MIT, Dept Mech Engn, Soft Act Mat Lab, Cambridge, MA 02139 USA
Samsung Display Res Inst, Yongin 446711, Gyeonggi Do, South KoreaMIT, Dept Mech Engn, Soft Act Mat Lab, Cambridge, MA 02139 USA
Koo, Hyunwoo
Yu, Cunjiang
论文数: 0引用数: 0
h-index: 0
机构:
Univ Houston, Dept Mech Engn, Houston, TX 77204 USAMIT, Dept Mech Engn, Soft Act Mat Lab, Cambridge, MA 02139 USA
Yu, Cunjiang
Zhao, Xuanhe
论文数: 0引用数: 0
h-index: 0
机构:
MIT, Dept Mech Engn, Soft Act Mat Lab, Cambridge, MA 02139 USA
MIT, Dept Civil & Environm Engn, Cambridge, MA 02139 USAMIT, Dept Mech Engn, Soft Act Mat Lab, Cambridge, MA 02139 USA
机构:
Penn State Univ, Ctr Neural Engn, Dept Engn Sci & Mech, University Pk, PA USAPenn State Univ, Ctr Neural Engn, Dept Engn Sci & Mech, University Pk, PA USA
Zhou, Tao
Yuk, Hyunwoo
论文数: 0引用数: 0
h-index: 0
机构:
SanaHeal Inc, Cambridge, MA 02139 USAPenn State Univ, Ctr Neural Engn, Dept Engn Sci & Mech, University Pk, PA USA