Effect of microwave treatment on current flow mechanisms in Au-TiBx-Al-Ti-n+-n-n+-GaN-Al2O3 ohmic contacts

被引:0
作者
A. E. Belyaev
N. S. Boltovets
S. A. Vitusevich
V. N. Ivanov
R. V. Konakova
Ya. Ya. Kudryk
A. A. Lebedev
V. V. Milenin
Yu. N. Sveshnikov
V. N. Sheremet
机构
[1] National Academy of Sciences,Lashkaryov Institute of Semiconductor Physics
[2] Orion Research Institute,Ioffe Physicotechnical Institute
[3] Russian Academy of Sciences,undefined
[4] Elma-Malachit Joint-Stock Company,undefined
来源
Semiconductors | 2010年 / 44卷
关键词
Charge Transport; Ohmic Contact; Rapid Thermal Annealing; Contact Structure; Contact Resistivity;
D O I
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中图分类号
学科分类号
摘要
The temperature dependences of the contact resistivity ρc of Au-TiBx Al-Ti-n+-n-n+-GaN-Al2O3 ohmic contacts have been studied before and after microwave treatment followed by nine-nonth room-temperature sample storage. The temperature dependences of ρc of initial samples were measured twice. The first measurement showed the temperature dependence typical of ohmic contacts; the repeated measurement in the temperature region above 270 K showed a ρc increase caused by metallic conductivity. After microwave treatment, the metallic conductivity in the ohmic contact is not observed. This is presumably associated with local heating of metal Ga inclusions under microwave irradiation and the formation, due to high chemical activity of liquid gallium, of compounds of it with other metallization components. In this case, the temperature dependence of ρc is controlled by ordinary charge transport mechanisms. After nine-nonth room-temperature storage, the temperature dependence of ?c is described by the tunneling mechanism of charge transport.
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页码:745 / 751
页数:6
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