Microplastic Deformation of Submicrocrystalline Copper at Room and Elevated Temperatures

of investigations of submicrocrystalline copper subjected to cold rolling after abc pressing by methods of backscatter electron diffraction and x-ray diffraction analysis are presented. It is demonstrated that after such combined intensive plastic deformation, the submicrocrystalline structure with average grain-subgrain structure elements having sizes of 0.63 μm is formed with relative fraction of high-angle grain boundaries of ~ 70% with texture typical for rolled copper. Results of investigation of microplastic deformation of copper with such structure at temperatures in the interval 295–473 K and with submicrocrystalline structure formed by cold rolling of coarse-grained copper are presented.