Fracture of Sn-3.5%Ag solder alloy under creep

被引：0
|
作者：
V. I. Igoshev
J. I. Kleiman
D. Shangguan
S. Wong
U. Michon
机构：
[1] Integrity Testing Laboratory Inc.,
[2] Visteon Automotive Systems,undefined
[3] Visteon Automotive Systems,undefined
[4] ESPEO.3,undefined
[5] Universite D’Orleans,undefined
来源：
Journal of Electronic Materials | 2000年 / 29卷
关键词：
Crack nucleation and propagation; microstructure; creep deformation;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Experimental data on the creep and failure of the Sn-3.0%Ag, Sn-3.5%Ag, and Sn-4.0%Ag lead free solder alloys are described. Further development of the alloys’ failure micromechanism, proposed earlier, is presented. Possible ways of improving the mechanical properties of Sn-Ag-based solder alloys are discussed.
引用
收藏
页码：1356 / 1361
页数：5
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