Controlling boron diffusion during rapid thermal annealing with co-implantation by amphoteric impurity atoms

A model for simulating the rapid thermal annealing of silicon structures implanted with boron and carbon is developed. The model provides a fair approximation of the process of boron diffusion in silicon, allowing for such effects as the electric field, the impact of the implanted carbon, and the clustering of boron. The migration process of interstitials is described according to their drift in the field of internal elastic stress.