Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates

被引：0
|
作者：
S. S. Wang
Y. H. Tseng
T. H. Chuang
机构：
[1] De-Lin Institute of Technology,Department of Mechanical Engineering
[2] Vishay General Semiconductor Taiwan Ltd.,Institute of Materials Science and Engineering
[3] Hsin-Tien,undefined
[4] National Taiwan University,undefined
来源：
Journal of Electronic Materials | 2006年 / 35卷
关键词：
In-49Sn/Ni; soldering reaction; ternary Ni; In; Sn; intermetallics; growth kinetics;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
The interfacial reactions between liquid In-49Sn solder and Ni substrates at temperatures ranging from 150°C to 450°C for 15 min to 240 min have been investigated. The intermetallic compounds formed at the In-49Sn/Ni interfaces are identified to be a ternary Ni33In20Sn47 phase using electron-probe microanalysis (EPMA) and x-ray diffraction (XRD) analyses. These interfacial intermetallics grow with increasing reaction time by a diffusion-controlled mechanism. The activation energy calculated from the Arrhenius plot of reaction constants is 56.57 kJ/mol.
引用
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页码：165 / 169
页数：4
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