Special issue on Design, Test, Integration and Packaging of MEMS and MOEMS, 2016

被引：0
作者：
Pascal Nouet
Bernd Michel
机构：
[1] LIRMM,
[2] CNRS/University of Montpellier,undefined
[3] Micro Materials Center,undefined
[4] Microsystem Technologies,undefined
来源：
Microsystem Technologies | 2018年 / 24卷
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页码：361 / 361
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