Study of Solidification and Heat Transfer Behavior of Mold Flux Through Mold Flux Heat Transfer Simulator Technique: Part II. Effect of Mold Oscillation on Heat Transfer Behaviors

Mold flux solidification and heat transfer experiments under both non-oscillation and oscillation modes have been conducted and compared with the help of Mold Flux Heat Transfer Simulator (MFHTS) technique. The results suggested that the steady-state responding heat flux in the mode of oscillation is smaller than that in non-oscillation operation, and a transition time is observed in the responding temperature and heat flux profiles during the oscillation experiments. The oscillation of mold would introduce the roughness of slag film surface and the enlargement of air gap at the interface of mold/flux film; thus, the interfacial thermal resistance was enhanced. In addition, the thermal conductivity of solid crystalline mold flux and mold/flux film interfacial thermal resistance at steady state were calculated in this work. The thermal conductivity of crystalline mold flux was about 1.43 to 1.76 W m−1 K−1, and the interfacial thermal resistance Rint in oscillation operation was calculated as 17.3 to 22.5 × 10−4 m2 (K W−1) in the measured region. The obtained interfacial thermal resistance Rint in this work is higher than that in non-oscillation operations.