Effect of the contact conductivity of the diamond–metal binder interface on the thermal conductivity of diamond-containing composites

被引:0
作者
R. S. Shmegera
Ya. O. Podoba
V. I. Kushch
A. S. Belyaev
机构
[1] National Academy of Sciences of Ukraine,Bakul Institute for Superhard Materials
来源
Journal of Superhard Materials | 2015年 / 37卷
关键词
diamond; metal binder; composite; interface; thermal resistance; model; efficient thermal conductivity;
D O I
暂无
中图分类号
学科分类号
摘要
The effect has been studied of the contact conductivity of the diamond–metal binder interface on the thermal conductivity of diamond-containing composites having two- and three-component nickel-based metal binders. A device and procedure have been developed for measuring the thermal conductivity coefficients of binders and based on them diamond-containing composites. The dependence of the thermal conductivity coefficients on the compositions (particularly, the presence of the carbide-forming additives) and structures has been analyzed. A theoretical model of the composite has been proposed, which allows for the real shape of a diamond crystal and contact conductivity of its faces. The estimation of the thermal contact conductivity of the interface has been derived by solving the inverse problem. It agrees satisfactory with the literature data on direct physical studies and similar estimates for composites with aluminum and copper binders. The influence of the contact resistance on the temperature mode of the diamond tool operation has been indicated by the results of modeling.
引用
收藏
页码:242 / 252
页数:10
相关论文
共 50 条
  • [41] Influence of isotopic content on diamond thermal conductivity
    Novikov, NV
    Podoba, AP
    Shmegera, SV
    Witek, A
    Zaitsev, AM
    Denisenko, AB
    Fahrner, WR
    Werner, M
    DIAMOND AND RELATED MATERIALS, 1999, 8 (8-9) : 1602 - 1606
  • [42] Effect of boron addition on interface microstructure and thermal conductivity of Cu/diamond composites produced by high temperature-high pressure method
    He, Jinshan
    Zhang, Hailong
    Zhang, Yang
    Zhao, Yameng
    Wang, Xitao
    PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, 2014, 211 (03): : 587 - 594
  • [44] Boosted the thermal conductivity of liquid metal via bridging diamond particles with graphite
    Zeng, Chengzong
    Shen, Xia
    Shen, Kun
    Bao, Linzhao
    Liao, Guangyin
    Shen, Jun
    JOURNAL OF COLLOID AND INTERFACE SCIENCE, 2025, 680 : 643 - 656
  • [45] On the structure formation of diamond-containing composites used in drilling and stone-working tools (A review)
    V. M. Kolodnits’kyi
    O. E. Bagirov
    Journal of Superhard Materials, 2017, 39 : 1 - 17
  • [46] Study of the hot-pressing sintering process of diamond/copper composites and their thermal conductivity
    Lu, Kaijie
    Wang, Chunju
    Wang, Changrui
    He, Haidong
    Fan, Xueliang
    Chen, Feng
    Qi, Fei
    JOURNAL OF ALLOYS AND COMPOUNDS, 2023, 960
  • [47] Modeling of Non-Stationary Thermal Processes in Composite Diamond-Containing Materials
    Deunezhev, Zalim N.
    Kardanova, Marianna R.
    Yakhutlov, Martin M.
    Zhemukhov, Ruslah Sh.
    Zhilyaev, Alan A.
    2018 IEEE INTERNATIONAL CONFERENCE QUALITY MANAGEMENT, TRANSPORT AND INFORMATION SECURITY, INFORMATION TECHNOLOGIES (IT&QM&IS), 2018, : 420 - 422
  • [48] Research progress in interface modification and thermal conduction behavior of diamond/metal composites
    Zhu, Ping
    Wang, Pingping
    Shao, Puzhen
    Lin, Xiu
    Xiu, Ziyang
    Zhang, Qiang
    Kobayashi, Equo
    Wu, Gaohui
    INTERNATIONAL JOURNAL OF MINERALS METALLURGY AND MATERIALS, 2022, 29 (02) : 200 - 211
  • [49] High thermal conductivity in diamond induced carbon fiber-liquid metal mixtures
    Zeng, Chengzong
    Ma, Chaofan
    Shen, Jun
    COMPOSITES PART B-ENGINEERING, 2022, 238
  • [50] Isotope Effect in Thermal Conductivity of Polycrystalline CVD-Diamond: Experiment and Theory
    Inyushkin, Alexander, V
    Taldenkov, Alexander N.
    Ralchenko, Victor G.
    Bolshakov, Andrey P.
    Khomich, Alexander, V
    CRYSTALS, 2021, 11 (04):