Features and mechanisms of growth of cubic silicon carbide films on silicon

The mechanisms and specific features of the growth of silicon carbide layers through vacuum chemical epitaxy in the range of growth temperatures from 1000 to 700°C have been considered. The structure of the heterojunction formed has been studied using the results of the performed investigations of photoluminescence spectra in the near-infrared wavelength range and the data obtained from the mass spectrometric analysis. It has been found that, in the silicon layer adjacent to the 3C-SiC/Si heterojunction, the concentration of point defects significantly increases and the dislocation structure is not pronounced. According to the morphological examinations of the surface of the growing film, by analogy with the theory of thermal oxidation of silicon, the theory of carbidization of surface silicon layers has been constructed. A distinctive feature of the model under consideration is the inclusion of the counter diffusion fluxes of silicon atoms from the substrate to the surface of the structure. The growth rate of films and the activation energy of diffusion processes have been estimated. The performed experiments in combination with the developed growth model have explained the aggregates of voids observed in practice under the silicon carbide layer formed in the silicon matrix and the possibility of forming a developed surface morphology (the island growth of films) even under conditions using only one flow of hydrocarbons in the reactor.