Microstructural Response of Highly Porous Sintered Nano-silver Particle Die Attachments to Thermomechanical Cycling

[1] Ramminger S(1998)Crack mechanism in wire bonding joints Microelectron. Reliab. 38 1301-undefined

[2] Türkes P(2006)Footprint study of ultrasonic wedge-bonding with aluminum wire on copper substrate J. Electron. Mater. 35 433-undefined

[3] Wachutka G(2000)The mechanical properties of lead-containing and lead-free solders—meeting the environmental challenge Proc. Inst. Mech. Eng. Part L J. Mater. Des. Appl. 214 153-undefined

[4] Lum I(2019)X-ray microtomography of thermal cycling damage in sintered nano-silver solder joints Adv. Eng. Mater. 21 1801029-undefined

[5] Mayer M(2012)Mechanical properties of nano-silver joints as die attach materials J. Alloys Compd. 514 6-undefined

[6] Zhou Y(2013)Low-temperature and low-pressure die bonding using thin Ag-flake and Ag-particle pastes for power devices IEEE Trans. Compon. Packag. Manuf. Technol. 3 923-undefined

[7] Plumbridge WJ(2011)Silver nanoparticle paste for low-temperature bonding of copper J. Electron. Mater. 40 1394-undefined

[8] Gagg CR(2021)Thermo-elasto-plastic phase-field modelling of mechanical behaviours of sintered nano-silver with randomly distributed micro-pores Comput. Methods Appl. Mech. Eng. 378 790-undefined

[9] Regalado IL(1986)The influences of porosity on the characteristics of sintered materials SAE Trans. 95 730-undefined

[10] Williams JJ(2021)Influence of the total porosity on the properties of sintered materials—a review Metals 11 256-undefined

[1] Ramminger S(1998)Crack mechanism in wire bonding joints Microelectron. Reliab. 38 1301-undefined

[2] Türkes P(2006)Footprint study of ultrasonic wedge-bonding with aluminum wire on copper substrate J. Electron. Mater. 35 433-undefined

[3] Wachutka G(2000)The mechanical properties of lead-containing and lead-free solders—meeting the environmental challenge Proc. Inst. Mech. Eng. Part L J. Mater. Des. Appl. 214 153-undefined

[4] Lum I(2019)X-ray microtomography of thermal cycling damage in sintered nano-silver solder joints Adv. Eng. Mater. 21 1801029-undefined

[5] Mayer M(2012)Mechanical properties of nano-silver joints as die attach materials J. Alloys Compd. 514 6-undefined

[6] Zhou Y(2013)Low-temperature and low-pressure die bonding using thin Ag-flake and Ag-particle pastes for power devices IEEE Trans. Compon. Packag. Manuf. Technol. 3 923-undefined

[7] Plumbridge WJ(2011)Silver nanoparticle paste for low-temperature bonding of copper J. Electron. Mater. 40 1394-undefined

[8] Gagg CR(2021)Thermo-elasto-plastic phase-field modelling of mechanical behaviours of sintered nano-silver with randomly distributed micro-pores Comput. Methods Appl. Mech. Eng. 378 790-undefined

[9] Regalado IL(1986)The influences of porosity on the characteristics of sintered materials SAE Trans. 95 730-undefined

[10] Williams JJ(2021)Influence of the total porosity on the properties of sintered materials—a review Metals 11 256-undefined