Correlation between process parameters and electrochemical surface state for electrochemical-mechanical polishing application of copper in acid- and alkali-based electrolyte

We examine the correlation between process parameters and electrochemical surface state for electrochemicalmechanical polishing (ECMP) application of copper (Cu) in alkali-based NaNO3 and acid-based HNO3 electrolyte. First, the effects of electrolyte concentration on the electrochemical surface reaction of Cu electrode were evaluated from the current-voltage (I–V) curve obtained by linear sweep voltammetry (LSV) method. Second, we fundamentally studied the chemical states and element composition of the Cu surface according to the concentration of the electrolyte and the potential variation using scanning electron spectroscopy (SEM) and X-ray diffraction (XRD) patterns. The proposed mechanism and analyses were a good methodology in finding suitable electrochemical process parameter for ECMP application.