Development of hybrid process for double-side flexible printed circuit boards using roll-to-roll gravure printing, via-hole printing, and electroless plating

被引：0
作者：
Janghoon Park
Jongsu Lee
Sungsik Park
Kee-Hyun Shin
Dongjin Lee
机构：
[1] Konkuk University,Department of Mechanical Design and Production Engineering
[2] Konkuk University,School of Mechanical Engineering
[3] Konkuk University,Flexible Display Roll
来源：
The International Journal of Advanced Manufacturing Technology | 2016年 / 82卷
关键词：
Flexible printed circuit board; Roll-to-roll; Printed electronics; Double-side printing; Via hole; Reliability test;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
A hybrid process including roll-to-roll (R2R) gravure printing, via-hole printing, and electroless plating was investigated for the creation of a double-side flexible printed circuit board (FPCB). A R2R gravure process with an Ag seed layer that includes front- and back-side printing with a polyimide film at the center was investigated. The gravure-printed Ag pattern was laser drilled for high accuracy. A via hole was filled with a low-viscosity Ag ink using the drop-casting method. In addition, an electroless Cu plating process was performed to increase the conductivity of the printed circuit. The interconnection performance was confirmed from the resistance values obtained using a feed-through test and microscopic images. To evaluate the reliability of the FPCB, a cyclic bending motion test was performed; stable electrical performance was observed even after 400,000 cycles. The results obtained in this study suggest that the proposed hybrid process for double-side FPCBs is viable for a mass production system.
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页码：1921 / 1931
页数：10
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