Effect of the Microstructure on Diffusion Bonded AA5083, AA6082 and AA7075 Aluminium Alloys

被引:2
作者
Venugopal S. [1 ]
Mahendran G. [2 ]
机构
[1] Department of Mechanical Engineering, Sathyabhama Institute of Science and Technology, Chennai, 600119, Tamil Nadu
[2] Department of Mechanical Engineering, IFET College of Engineering, Villupuram, 605108, Tamil Nadu
来源
Journal of The Institution of Engineers (India): Series C | 2019年 / 100卷 / 04期
关键词
AA5083; AA6082; AA7075; Bonding strength; Diffusion bonding; Optical microscopy and TEM;
D O I
10.1007/s40032-018-0472-4
中图分类号
学科分类号
摘要
Rolled plates of aluminium alloys AA5083, AA6082 and AA7075 of 5 mm thickness are joined by diffusion bonding at varied parameters. The microstructure evolution of AA5083, AA6082 and AA7075 aluminium alloys is characterized by Transmission Electron Microscopy (TEM). Metallurgical investigations and mechanical tests are also performed to correlate the results of the TEM investigations with the mechanical properties of the produced diffusion bonded joints. It is observed that the bonding and shear strength of the alloys increase with the increase in bonding temperature, due to the diffusion of micro-constituents in the interface. High temperature enhances the uniform distribution of secondary phase particles and reduces pore formation/defects in the bonded joints. © 2018, The Institution of Engineers (India).
引用
收藏
页码:617 / 626
页数:9
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