Comparative effectiveness of infrared heat sources for mounting and dismounting electronic modules

被引：0

作者：

Lanin V.L. ^{[1
]}

Lappo A.I. ^{[1
]}

机构：

[1] Belarusian State University of Informatics and Radioelectronics, Minsk

来源：

Surface Engineering and Applied Electrochemistry | 2017年 / 53卷 / 04期

关键词：

dismounting; electronic modules; heat sources; infrared radiation; mounting;

D O I：

10.3103/S106837551704010X

中图分类号：

学科分类号：

摘要：

efficiency of short- and medium-wave infrared (IR) heat sources used to mount and dismount electronic modules is assessed. The analysis of the models of thermal fields shows that for KGM 30/300 halogen IR lamps, the heating nonuniformity for a printed circuit board is 45–55°С, and for the casings of electronic components, the temperature varies from 90 to 100°С. For an Elstein SHTS/4 ceramic IR heater, the heating nonuniformity for a printed circuit board is 8–13°С, the temperature of SMD component casings differs from temperature of the the printed circuit board: in BGA by 28–32°С, in QFP by 24–26°С, and in SMD by 5–20°С. The application of medium-wave ceramic infrared sources makes it possible to attain a higher heating uniformity in the working area and ensure an optimal temperature profile when mounting and dismounting surface-mounted electronic components. © 2017, Allerton Press, Inc.

引用

页码：394 / 399

页数：5

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