Analysis of “Kiss” Bonds Between Composite Laminates

One of the leading challenges to designing lightweight, cost-effective bonded structures is to detect low shear strength “kiss” bonds where no other defects such as voids and cracks exist. To develop a nondestructive testing method that is sensitive to kiss bonds, standards need to be fabricated with known strength values. In the current work, we attempt to create kiss bonds in between carbon fiber composite laminates that have been bonded with epoxy film adhesive and epoxy paste adhesive. Based on ultrasonic testing, when creating true kiss bonds using film adhesives, a complete disbond could not be avoided because of thermally induced stresses during the high-temperature cure. However, further work demonstrated that kiss bonds can be formed using room-temperature curable epoxy paste adhesives by creating an amine blush on the epoxy surface or applying a release agent on the bonding surfaces.