(Sn-Ag)eut + Cu Soldering Materials, Part I: Wettability Studies

被引：33

作者：

Gasior W. ^{[1
]}

Moser Z. ^{[1
]}

Pstruś J. ^{[1
]}

Bukat K. ^{[2
]}

Sitek J. ^{[2
]}

Kisiel R. ^{[3
]}

机构：

[1] Polish Academy of Sciences, Inst. of Metall./Materials Science, 30-059 Kraków

[2] Tele and Radio Research Institute, 03-450 Warszawa

[3] Inst. Microelectron./Optoelectron., Warsaw University of Technology, 00-662 Warszawa

来源：

Journal of Phase Equilibria and Diffusion | 2004年 / 25卷 / 02期

关键词：

Surface Tension; Contact Angle; Interfacial Tension; Ternary Alloy; Solder Alloy;

D O I：

10.1361/15477030418497

中图分类号：

学科分类号：

摘要：

The maximum bubble pressure, dilatometric, and meniscographic methods were used in investigations of the surface tension, density, wetting time, wetting force, contact angles, and interfacial tension of liquid (Sn-Ag)eut and two (Sn-Ag)eut + Cu alloys (Cu at.% = 0.46 and 0.74). The density and surface tension measurements were conducted in the temperature range from 230 to 950°C, and the meniscographic investigations were carried out at 252°C. The resultant values of surface tension were compared with those calculated from Butler's model based on optimized thermodynamic parameters and our data from earlier investigations. In an earlier study, experimental data for all investigated compositions (Cu at.% =1.08 to 6.5) exhibit an increase in the surface tension with interesting temperature, while both ternary alloys of this study show a slight lowering tendency in comparison to (Sn-Ag)eut. A more evident decreasing tendency of surface tension and interfacial tension was noted in meniscographic measurements, noting that data of interfacial tension are always lower than surface tension due to the role of the flux. Eight different fluxes were tested to select the lowest interfacial tension for the (Sn-Ag)eut. ROLI (3% solids), which is the alcoholic solution of organic compounds and rosin activated by halogens, was recommended. In (Sn-Ag)eut + Cu Soldering Materials, Part II: Electrical and Mechanical Studies, for the same (Sn-Ag)eut and (Sn-Ag)eut + Cu alloys (Cu at. % = 0.46 and 0.74), the electrical resistance and strength measurements will be presented in parallel with printed-circuit boards in wave soldering at 260°C.

引用

页码：115 / 121

页数：6

共 17 条

[1]

Butler J.A.V., The Thermodynamic of the Surfaces of Solutions, Proc. R. Soc., 135 A, (1932)

[2]

Glazer J., Microstructure and Mechanical Properties of Pb-Free Solder Alloys for Low-Cost Electronic Assambly: A Review, J. Electron. Mater., 23, pp. 693-700, (1994)

[3]

Miller C.M., Anderson I.E., Smith J.F., A Viable Tin-Lead Solders Substitute: Sn-Ag-Cu, J. Electron. Mater., 23, (1994)

[4]

Mizyaki M., Mizutani M., Takemoto T., Matsunawa A., Conditions for Measurements of Surface Tension of Solders with a Wetting Balance Tester, Trans. JWRI, 26, pp. 81-84, (1997)

[5]

Lee H.M., Yoon S.W., Lee B.-J., Thermodynamic Prediction of Interface at Cu/Solder Joints, J. Electron. Mater., 27, pp. 1161-1166, (1998)

[6]

Vianco P.T., Rejent J.A., Properties of Ternary Sn-Ag-Bi Solder Alloys: Part II-Wettability and Mechanical Properties Analyses, J. Electron. Mater., 28, pp. 1138-1143, (1999)

[7]

Moon K.-W., Boettinger W.J., Kattner U.R., Biancaniello F.S., Handwerker C.A., Experimental and Thermodynarnic Assessment of Sn-Ag-Cu Solder Alloys, J. Electron. Mater., 29, pp. 1122-1136, (2000)

[8]

Ohnuma I., Miyashita M., Anzai A., Liu X.J., Ohtani H., Ishida K., Phase Equilibria and the Related Properties of Sn-Ag-Cu Based Pb-Free Solder Alloys, J. Electron. Mater., 29, pp. 1137-1147, (2000)

[9]

Takemoto T., Miyazaki M., Effect of Excess Temperature Above Liquidus of Lead-Free Solders on Wetting Time in a Wetting Balance Test, Mater. Trans., 42, (2001)

[10]

Anderson I.E., Foley J.C., Cook B.A., Harringa J., Terpstra R.L., Unal O., Alloying Effects in Near-Eutectic Sn-Ag-Cu Solders Alloys for Improved Microstructural Stability, J. Electron. Mater., 30, pp. 1050-1059, (2001)

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