Experimental study on thermal performance of heat sinks: the effect of hydraulic diameter and geometric shape

被引:0
作者
M. Marzougui
M. Hammami
R. Ben Maad
机构
[1] University Tunis El-Manar,Laboratory of Energetic and the Thermal and Mass Transfer (LETTM), Faculty of Sciences Tunis
来源
Heat and Mass Transfer | 2016年 / 52卷
关键词
Heat Transfer; Heat Transfer Coefficient; Heat Exchanger; Nusselt Number; Heat Sink;
D O I
暂无
中图分类号
学科分类号
摘要
The main purpose of this study is focused on experimental investigation of cooling performance of various minichannel designs. The hydraulic dimension of one of the heat sink is 3 mm while that of the other is 2 mm. Deionised water was used as the coolant for studies conducted in both the heat sinks. Tests were done for a wide range of flow rates (0.7 l–9 l h−1) and heat inputs (5–40 kW/m2). Irrespective of the hydraulic diameter and the geometric configuration, profits and boundaries of each channel shape are analyzed and discussed in the clarity of experimental data. The total thermal resistance and the average heat transfer coefficient are compared for the various channels inspected.
引用
收藏
页码:2091 / 2100
页数:9
相关论文
共 79 条
[1]  
Tuckerman DB(1981)High-performance heat sinking for VLSI IEEE Electron Device Lett 2 126-129
[2]  
Pease RFW(2001)A comparative analysis of studies on heat transfer and fluid flow in microchannels Microscale Therm Eng 5 293-311
[3]  
Sobhan CB(2004)Microchannel heat sinks: an overview of the state-of-the-art Microscale Therm Eng 8 183-205
[4]  
Garimella SV(2005)Analysis of laminar convective heat transfer in micro heat exchanger for stacked multi-chip module Microsyst Technol 11 1176-1186
[5]  
Hassan I(2009)Single-phase heat transfer in microchannels the importance of scaling effects Appl Therm Eng 29 17-18
[6]  
Phutthavong P(2011)Effects of magnetic field on nanofluid forced convection in a partially heated microchannel Int J Non-linear Mech 46 1373-1382
[7]  
Abdelgawad M(1993)Experimental measurements of fluid flow and heat transfer in microchannel cooling passages in a chip substrate Adv Electron Packag ASME EEP 199 685-692
[8]  
Kang MK(2003)An experimental study of convective heat transfer in silicon microchannels with different surface conditions Int J Heat Mass Transf 46 2547-2556
[9]  
Shin JH(2006)Flow and heat transfer in microchannels with rough wall surface Energy Convers Manag 47 1311-1325
[10]  
Lee HH(1999)Developing convective heat transfer in deep rectangular microchannels Int J Heat Fluid Flow 20 149-157