Establishing a theoretical model for abrasive removal depth of silicon wafer chemical mechanical polishing by integrating a polishing times analytical model and specific down force energy theory (vol 95, pg 4671, 2018)

被引：1

作者：

Lin, Zone-Ching ^{[1
]}

Wang, Ren-Yuan ^{[2
]}

Jhang, Zih-Wun ^{[1
]}

机构：

[1] Natl Taiwan Univ Sci & Technol, Dept Mech Engn, 43 Keelung Rd,Sect 4, Taipei, Taiwan

[2] Army Acad ROC, Dept Mech Engn, 750 Longdong Rd, Zhongli City, Taoyuan County, Taiwan

来源：

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY | 2018年 / 95卷 / 9-12期

关键词：

Abrasive removal depth; Chemical mechanical polishing; Polishing times; Silicon wafer; Specific down force energy;

D O I：

10.1007/s00170-017-1532-2

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

The original version of this article unfortunately contained a mistake. The presentation of Fig. 8 was incorrect. The final version of this figure is provided here.

引用

页码：4685 / 4686

页数：2