Thermal stability of surface-acoustic-wave devices in the microwave band

被引:0
作者
S. G. Suchkov
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来源
Journal of Communications Technology and Electronics | 2006年 / 51卷
关键词
85.50.-n;
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摘要
Thermal stability of surface-acoustic-wave devices in the microwave band is studied in relation to the thickness and elastic properties of the metal film forming the electrode structure. Thermally stable angles of the singly rotated Y cuts of quartz plates are found for frequencies of 1 and 2 GHz. The dependence of thermal stability on the metallization ratio of the electrode structure is obtained.
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页码:474 / 478
页数:4
相关论文
共 8 条
  • [1] Henry-Briot E.(2001)undefined IEEE Trans. Ultrason. Ferroelectr. Freq. Control 48 538-undefined
  • [2] Ballandras S.(1977)undefined Akust. Zh. 23 331-undefined
  • [3] Marianneau G.(2002)undefined Radiotekh. Elektron. (Moscow) 47 510-undefined
  • [4] Martin G.(undefined)undefined undefined undefined undefined-undefined
  • [5] Shevelko M. M.(undefined)undefined undefined undefined undefined-undefined
  • [6] Yakovlev L. A.(undefined)undefined undefined undefined undefined-undefined
  • [7] Suchkov S. G.(undefined)undefined undefined undefined undefined-undefined
  • [8] Barinov D. A.(undefined)undefined undefined undefined undefined-undefined