Analysis of wire-drawing process with friction and thermal conditions obtained by inverse engineering

被引:0
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作者
Changsun Moon
Naksoo Kim
机构
[1] Sogang University,Department of Mechanical Engineering
关键词
Wire-drawing; Dimensional change; Quality of drawn product; Friction condition; Thermal condition; Inverse engineering;
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学科分类号
摘要
In cold wire-drawing process, which is performed at room temperature, heat is generated because of plastic work and friction at the workpiece-die interface. Temperature distribution in both the workpiece and the die affects thermal expansion, deformation pattern, and elastic recovery. These effects produce the final dimension of the drawn products. We propose inverse engineering procedures to determine friction and thermal conditions by comparing simple measurements with the computational results of the drawing power and the temperature changes of the die. The conditions were then used to simulate numerically the deformation behavior of the wire and the temperature distribution in the die. The thermal effects on the quality of drawn products were investigated based on the prediction of the final dimensions of the products. Therefore, thermal effects should not be ignored even in cold wire-drawing process because reasonable numerical results were acquired in comparing the experiments.
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页码:2903 / 2911
页数:8
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