Sub-surface Damage of Ultra-Thin Monocrystalline Silicon Wafer Induced by Dry Polishing

被引：1
作者：
Xundi Zhang
Chenlin Yang
Yumei Zhang
Anmin Hu
Ming Li
Liming Gao
Huiqin Ling
Tao Hang
机构：
[1] Shanghai Jiao Tong University,State Key Laboratory of Metal Matrix Composites, Key Laboratory for Thin Film and Microfabrication Technology of the Ministry of Education, School of Materials Science and Engineering
来源：
Electronic Materials Letters | 2020年 / 16卷
关键词：
Ultra-thin wafer; Dislocation; Sub-surface damage; Polishing; Silicon;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：355 / 362
页数：7
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