共 151 条
- [11] Zhao Q(2014)Dynamic stress modeling on wafer thinning process and reliability analysis for TSV wafer IEEE Trans. Compon. Packag. Manuf. Technol. 4 1432-580
- [12] To S(2018)Impact of various charge states of hydrogen on passivation of dislocation in silicon Electron. Mater. Lett. 14 574-998
- [13] Goel S(2013)Thermomechanical strain measurements by synchrotron X-ray diffraction and data interpretation for through-silicon vias Appl. Phys. Lett. 103 022107-832
- [14] Luo X(2011)Evaluation of two-dimensional strain distribution by STEM/NBD Ultramicroscopy 111 995-146
- [15] Agrawal A(2009)Improved precision in strain measurement using nanobeam electron diffraction Appl. Phys. Lett. 95 123114-17939
- [16] Reuben RL(2015)Strain mapping at nanometer resolution using advanced nano-beam electron diffraction Appl. Phys. Lett. 106 253107-405
- [17] Inoue F(2008)Electron diffraction with ten nanometer beam size for strain analysis of nanodevices Appl. Phys. Lett. 93 161906-97
- [18] Jourdain A(2011)Experimental study of lattice distortion in ellipsoid-like nano-crystallites of copper Micron 42 826-1000
- [19] Peng L(1998)Quantitative measurement of displacement and strain fields from HREM micrographs Ultramicroscopy 74 131-587
- [20] Phommahaxay A(2004)Nanoscale waviness of low-angle grain boundaries Proc Natl Acad Sci 101 17936-286