Conductivity and mechanical properties of conductive adhesive with silver nanowires

被引:0
|
作者
Xing-Shi Li
Xiong-Zhi Xiang
Lei Wang
Xiao-Jun Bai
机构
[1] Shenzhen University,College of Materials Science and Engineering, Shenzhen Key Laboratory of Special Functional Materials
来源
Rare Metals | 2018年 / 37卷
关键词
Silver nanowires; Conductive filler; Bulk resistivity; Mechanical properties;
D O I
暂无
中图分类号
学科分类号
摘要
引用
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页码:191 / 195
页数:4
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