Interfacial Behaviors in Cu/Molten Sn–58Bi/Cu Solder Joints Under Coupling with Thermal and Current Stressing

被引：0
作者：
Fengjiang Wang
Hong Chen
Dongyang Li
Zhijie Zhang
Xiaojing Wang
机构：
[1] Jiangsu University of Science and Technology,Provincial Key Laboratory of Advanced Welding Technology
来源：
Electronic Materials Letters | 2019年 / 15卷
关键词：
Electromigration; Thermomigration; Temperature gradient; Sn–Bi solder; Bi segregation; IMC;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：36 / 48
页数：12
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