Characterization of MEMS Devices for the Study of Superfluid Helium Films

被引:0
|
作者
M. González
P. Bhupathi
B. H. Moon
P. Zheng
G. Ling
E. Garcell
H. B. Chan
Y. Lee
机构
[1] University of Florida,Department of Physics
来源
Journal of Low Temperature Physics | 2011年 / 162卷
关键词
Superfluid films; MEMS; Low-temperature devices;
D O I
暂无
中图分类号
学科分类号
摘要
Measurements on the mechanical properties of MEMS resonators were performed to characterize such devices at room temperature and low temperatures. Using state-of-the-art silicon integrated circuit technology, we have designed, fabricated, and manufactured resonators consisting of a pair of parallel plates with a well-defined gap whose size can be controlled with a high accuracy down to the sub-micron range. A full study of resonance properties at various pressures was performed at room temperature. We will discuss the details of design, fabrication, and operation. These studies open up a window of opportunities to look for novel phenomena in quantum fluids such as in superfluid 3He films.
引用
收藏
页码:661 / 668
页数:7
相关论文
共 50 条
  • [41] Single wafer encapsulation of MEMS devices
    Candler, RN
    Park, WT
    Li, HM
    Yama, G
    Partridge, A
    Lutz, M
    Kenny, TW
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2003, 26 (03): : 227 - 232
  • [42] Angular measurement for rotational MEMS devices
    Yu Chao
    Wang Boxiong
    Zheng Hanqing
    Luo Xiuzhi
    ISTM/2007: 7TH INTERNATIONAL SYMPOSIUM ON TEST AND MEASUREMENT, VOLS 1-7, CONFERENCE PROCEEDINGS, 2007, : 4921 - 4924
  • [43] Metal Wafer Bonding for MEMS Devices
    Dragoi, Viorel
    Cakmak, Erkan
    Pabo, Eric
    ROMANIAN JOURNAL OF INFORMATION SCIENCE AND TECHNOLOGY, 2010, 13 (01): : 65 - 72
  • [44] Micro Fork Hinge for MEMS Devices
    Haobing Liu
    Franck Chollet
    实验力学, 2006, (01) : 61 - 70
  • [45] RF MEMS devices for communication systems
    Mansour, RR
    Yan, D
    Bakri-Kassem, M
    Daneshmand, M
    Sarker, N
    SMART MATERIALS III, 2005, 5648 : 109 - 113
  • [46] Critical challenges in packaging MEMS devices
    Darveaux, R
    Munukutla, L
    2005 IEEE/SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE AND WORKSHOP: ADVANCING SEMICONDUCTOR MANUFACTURING EXCELLENCE, 2005, : 211 - 217
  • [47] Accelerating aging failures in MEMS devices
    Tanner, DM
    Walraven, JA
    Dugger, MT
    Parson, TB
    2005 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 43RD ANNUAL, 2005, : 317 - 324
  • [48] Carbon nanotube integration into MEMS devices
    Hanein, Yael
    PHYSICA STATUS SOLIDI B-BASIC SOLID STATE PHYSICS, 2010, 247 (11-12): : 2635 - 2640
  • [49] Experimental Study of Electrical Breakdown in MEMS/NEMS Devices With Deep Submicron Gaps
    Matthews, Justin
    Wen, Haoran
    Ayazi, Farrokh
    JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2023, 32 (05) : 413 - 415
  • [50] Study on Indoor Positioning and Navigation Algorithms Based on the MEMS Inertial Devices and Smartphone
    Zhang Huiqing
    Dai Ruyong
    Xu Xiaomin
    PROCEEDINGS OF THE 28TH CHINESE CONTROL AND DECISION CONFERENCE (2016 CCDC), 2016, : 1787 - 1792