Thermal fracture of functionally graded plate with parallel surface cracks

被引：0

作者：

Feng Y. ^{[1
]}

Jin Z. ^{[1
]}

机构：

[1] Department of Mechanical Engineering, University of Maine, Orono

来源：

Acta Mechanica Solida Sinica | 2009年 / 22卷 / 5期

关键词：

alternating lengths; functionally graded material; parallel cracks; stress intensity factor; thermal fracture;

D O I：

10.1016/S0894-9166(09)60296-2

中图分类号：

学科分类号：

摘要：

This work examines the fracture behavior of a functionally graded material (FGM) plate containing parallel surface cracks with alternating lengths subjected to a thermal shock. The thermal stress intensity factors (TSIFs) at the tips of long and short cracks are calculated using a singular integral equation technique. The critical thermal shock ΔTc that causes crack initiation is calculated using a stress intensity factor criterion. Numerical examples of TSIFs and ΔTc for an Al2O3/Si3N4 FGM plate are presented to illustrate the effects of thermal property gradation, crack spacing and crack length ratio on the TSIFs and ΔTc. It is found that for a given crack length ratio, the TSIFs at the tips of both long and short cracks can be reduced significantly and ΔTc can be enhanced by introducing appropriate material gradation. The TSIFs also decrease dramatically with a decrease in crack spacing. The TSIF at the tips of short cracks may be higher than that for the long cracks under certain crack geometry conditions. Hence, the short cracks instead of long cracks may first start to grow under the thermal shock loading. © 2009 The Chinese Society of Theoretical and Applied Mechanics.

引用

页码：453 / 464

页数：11

共 36 条

[1]

Gupta T.K., Strength degradation and crack propagation in thermally shocked Al<sub>2</sub>O<sub>3</sub>, Journal of the American Ceramic Society, 43, pp. 249-253, (1972)

[2]

Geyer J.F., Nemat-Nasser S., Experimental investigation of thermally induced interacting cracks in brittle solids, International Journal Solids and Structures, 18, pp. 349-356, (1982)

[3]

Bahr H.A., Fischer G., Weiss H.J., Thermal shock crack patterns explained by single and multiple crack growth, Journal of Materials Science, 21, pp. 2716-2720, (1986)

[4]

Nemat-Nasser S., Keer L.M., Parihar K.S., Unstable growth of thermally induced interacting cracks in brittle solids, International Journal of Solids Structures, 14, pp. 409-430, (1978)

[5]

Bahr H.A., Weiss H.J., Maschke H.G., Meissner F., Multiple crack propagation in a strip caused by thermal shock, Theoretical and Applied Fracture Mechanics, 10, pp. 219-226, (1988)

[6]

Rizk A.A., Transient thermal stress intensity factors for periodic array of cracks in a half-plane due to convective cooling, Journal of Thermal Stresses, 26, pp. 443-456, (2003)

[7]

Rizk A.A., Convective thermal shock of an infinite plate with periodic edge cracks, Journal of Thermal Stresses, 28, pp. 103-119, (2005)

[8]

Jin Z.H., Feng Y.Z., An array of parallel edge cracks with alternating lengths in a strip subjected to a thermal shock, Journal of Thermal Stresses, 32, pp. 431-447, (2009)

[9]

Kawasaki A., Watanabe R., Fabrication of disk-shaped functionally gradient materials by hot pressing and their thermomechanical performance, Ceramic Transactions, 34, pp. 157-164, (1993)

[10]

Kokini K., DeJonge J., Rangaraj S., Beardsley B., Thermal shock of functionally graded thermal barrier coatings, Ceramic Transactions, 114, pp. 213-221, (2001)

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