共 101 条
[1]
Panchenko I(2019)Effects of isothermal storage on grain structure of Cu/Sn/Cu microbump interconnects for 3D stacking Microelectron Reliab 102 113296-1211
[2]
Wolter KJ(2020)Interfacial transfer and phase evolution between Cu and Sn solder doped with minor Cu, Ag and Ni: experimental and theoretical investigations Appl Phys A 126 652-24523
[3]
Croes K(2021)Effects of doping trace Ni element on interfacial behavior of Sn/Ni (polycrystal/single-crystal) joints Solder Surf Mt Tech 59 1198-1420
[4]
Yang MY(2011)Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process Acta Mater 278 128424-7
[5]
Chen JS(2020)Effect of crystal structure of nickel substrates on interfacial behaviors in Sn/Ni soldered joints Mater Lett 32 24507-248
[6]
Yang J(2021)Interfacial reaction, wettability, and shear strength of ultrasonic-assisted lead-free solder joints prepared using Cu–GNSs-doped flux J Mater Sci: Mater Electron 4 7117-258
[7]
Wang JN(2014)Size effect model on kinetics of interfacial reaction between Sn-xAg-yCu solders and Cu substrate Sci Rep 308 1419-4150
[8]
Chen JS(2005)Electronics without lead Science 49 1-125
[9]
Zhang ZY(2016)Effects of self-aligned electroplating Cu pillar/Sn-xAg bump on dense Al lines for chip-to-package connection Mat Sci in Semicon Proc 99 239-695
[10]
Li JF(2018)Effect of Ag Mater Res Bull 188 241-252