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Effect of additive triblock copolymer PEP-3100 on bottom-up filling in electroless copper plating
被引：0
作者：
Xu Wang
Zhifeng Yang
Zenglin Wang
机构：
[1] Shaanxi Normal University,Key Laboratory of Applied Surface and Colloid Chemistry, Ministry of Education, and School of Chemistry and Materials Science
[2] College of Chemistry and Life Science Lishui University,undefined
来源：
Russian Journal of Electrochemistry
|
2012年
/
48卷
关键词：
bottom-up fill;
electroless plating;
PEP-3100;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Bottom-up copper filling for different sub-micrometer trenches was investigated by electroless deposition technique using a PO-EO-PO triblock copolymer termed PEP-3100 as an additive. It was found that PEP-3100 (molecular weight 3100) had a strong inhibition for the electroless copper deposition. The bottom-up filling behavior of electroless copper bath for different trenches was investigated in a plating bath containing 1.0 mg l−1 PEP-3100. The cross-section SEM observation indicated the trenches with different widths ranging from 100 to 380 nm were all filled completely by electroless copper.
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页码：99 / 103
页数：4
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