Bauschinger Effect Analysis in Polycrystalline Copper: an Atomistic Simulation

被引:0
作者
Ashutosh Rajput
Surajit Kumar Paul
机构
[1] Indian Institute of Technology Patna,Department of Mechanical Engineering
关键词
Molecular dynamics simulation; Dislocation; Stacking fault; Twining; Cyclic straining;
D O I
10.1007/s41403-021-00266-3
中图分类号
学科分类号
摘要
Bauschinger effect has been analyzed in polycrystalline copper using the molecular dynamic simulation. The models of polycrystalline copper have 10 and 20 grains and it is deformed at a constant strain rate of 109 s−1. In the polycrystalline copper, yielding is observed by nucleation of 1/6 < 112 > Shockley partial dislocation. The interaction between dislocations has been noticed during subsequent cyclic deformation. Generation of stacking faults and twining occur in tensile loading, while removal of stacking faults and de-twining are noted during unloading and reloading in the reverse direction. Moreover, cyclic softening is appreciated by the reduction in total dislocation line length.
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页码:235 / 242
页数:7
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