Highly flexible transparent conductive films with a sandwich structure consisted of graphene/silver nanowires (AgNWs)/graphene (GAG) were fabricated by a facile method of combining vacuum filtration with acetone vapor treatment. This approach involves two processes: the vacuum filtration of the dispersion solution of the graphene, the AgNWs, and the graphene in turn through a porous mixed cellulose esters membrane (MCEM); the treatment of MCEM using acetone vapor to form a transparent GAG film. The GAG film has sheet resistances of as low as ∼4.6 Ω/□ at the transmittance of ∼81% at 550 nm, and exhibited impressive mechanical robustness against bending, scratching and adhering. This excellent performance can be attributed to the superior properties of the high-quality graphene and its roles of not only connecting the discrete AgNWs but also binding them tightly by its restacking characteristic in a sandwich-structured form. The results suggest that the GAG film has potential applications in flexible electronic and optoelectronic devices.
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Zhejiang Univ, Sch Mat Sci & Engn, State Key Lab Silicon Mat, Hangzhou 310027, Peoples R ChinaZhejiang Univ, Sch Mat Sci & Engn, State Key Lab Silicon Mat, Hangzhou 310027, Peoples R China
Zhang, Yan
Bai, Shengchi
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Zhejiang Univ, Sch Mat Sci & Engn, State Key Lab Silicon Mat, Hangzhou 310027, Peoples R ChinaZhejiang Univ, Sch Mat Sci & Engn, State Key Lab Silicon Mat, Hangzhou 310027, Peoples R China
Bai, Shengchi
Chen, Tianrui
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Zhejiang Univ, Sch Mat Sci & Engn, State Key Lab Silicon Mat, Hangzhou 310027, Peoples R ChinaZhejiang Univ, Sch Mat Sci & Engn, State Key Lab Silicon Mat, Hangzhou 310027, Peoples R China
Chen, Tianrui
Yang, Hui
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Zhejiang Univ, Sch Mat Sci & Engn, State Key Lab Silicon Mat, Hangzhou 310027, Peoples R China
Zhejiang Univ, Zhejiang California Int Nanosyst Inst, Hangzhou 310058, Peoples R ChinaZhejiang Univ, Sch Mat Sci & Engn, State Key Lab Silicon Mat, Hangzhou 310027, Peoples R China
Yang, Hui
Guo, Xingzhong
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Zhejiang Univ, Sch Mat Sci & Engn, State Key Lab Silicon Mat, Hangzhou 310027, Peoples R ChinaZhejiang Univ, Sch Mat Sci & Engn, State Key Lab Silicon Mat, Hangzhou 310027, Peoples R China
机构:
Department of Materials and Food, University of Electronic Science and Technology of China, Zhongshan Institute, ZhongshanDepartment of Materials and Food, University of Electronic Science and Technology of China, Zhongshan Institute, Zhongshan
Wang K.
Yang X.
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State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Microelectronics and Solid-State Electronics, University of Electronic Science and Technology of China, ChengduDepartment of Materials and Food, University of Electronic Science and Technology of China, Zhongshan Institute, Zhongshan
Yang X.
Li Z.-L.
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State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Microelectronics and Solid-State Electronics, University of Electronic Science and Technology of China, ChengduDepartment of Materials and Food, University of Electronic Science and Technology of China, Zhongshan Institute, Zhongshan
Li Z.-L.
Xie H.
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Department of Materials and Food, University of Electronic Science and Technology of China, Zhongshan Institute, ZhongshanDepartment of Materials and Food, University of Electronic Science and Technology of China, Zhongshan Institute, Zhongshan
Xie H.
Zhao Y.-Z.
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Department of Materials Science and Engineering, Tsinghua University, BeijingDepartment of Materials and Food, University of Electronic Science and Technology of China, Zhongshan Institute, Zhongshan
Zhao Y.-Z.
Wang Y.-H.
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Department of Materials and Food, University of Electronic Science and Technology of China, Zhongshan Institute, ZhongshanDepartment of Materials and Food, University of Electronic Science and Technology of China, Zhongshan Institute, Zhongshan
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Univ Sci & Technol China, Sch Mat Sci & Engn, Inst Met Res, Chinese Acad Sci, Shenyang 110016, Peoples R ChinaUniv Sci & Technol China, Sch Mat Sci & Engn, Inst Met Res, Chinese Acad Sci, Shenyang 110016, Peoples R China
Zheng, Boda
Zhu, Qingsheng
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Univ Sci & Technol China, Sch Mat Sci & Engn, Inst Met Res, Chinese Acad Sci, Shenyang 110016, Peoples R ChinaUniv Sci & Technol China, Sch Mat Sci & Engn, Inst Met Res, Chinese Acad Sci, Shenyang 110016, Peoples R China
Zhu, Qingsheng
2020 21ST INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT),
2020,
机构:
Department of Materials and Food, University of Electronic Science and Technology of China, Zhongshan InstituteDepartment of Materials and Food, University of Electronic Science and Technology of China, Zhongshan Institute
王可
杨星
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State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Microelectronics and Solid-State Electronics, University of Electronic Science and Technology of ChinaDepartment of Materials and Food, University of Electronic Science and Technology of China, Zhongshan Institute
杨星
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李志凌
谢辉
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Department of Materials and Food, University of Electronic Science and Technology of China, Zhongshan InstituteDepartment of Materials and Food, University of Electronic Science and Technology of China, Zhongshan Institute
谢辉
赵玉珍
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Department of Materials Science and Engineering, Tsinghua UniversityDepartment of Materials and Food, University of Electronic Science and Technology of China, Zhongshan Institute
赵玉珍
王悦辉
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Department of Materials and Food, University of Electronic Science and Technology of China, Zhongshan InstituteDepartment of Materials and Food, University of Electronic Science and Technology of China, Zhongshan Institute