Analytical Fatigue Life Prediction of Ball Grid Array Solder Joints

被引:0
作者
Iulia–Eliza Ţinca
Arjana Davidescu
机构
[1] University Politehnica Timişoara,Department of Mechatronics
来源
Journal of Electronic Materials | 2023年 / 52卷
关键词
Packaging; solder fatigue; reliability; failure analysis; virtual prototyping;
D O I
暂无
中图分类号
学科分类号
摘要
This study evaluates the applicability of rapid life prediction methods of integrated circuit packages. Although computing power is becoming less of an issue, the complexity and inputs required for finite element analysis of electronics still need to be improved. We analyze the life estimation of ball grid array components using the Engelmaier model, compared to the closed-form Ansys Sherlock computer-aided engineering tool. The latter addresses some of the caveats of the analytical Engelmaier model. The study shows that the main advantage of the discussed analytical approaches is the fast assessment of parameter influence. However, validation is challenging due to the simplifications assumed in analytical life prediction models. Researchers and engineers should consider both the applicability and limitations of the approaches in the decision-making process.
引用
收藏
页码:7991 / 8000
页数:9
相关论文
共 25 条
[1]  
Piromalis D(2022)Digital twins in the automotive industry: the road toward physical-digital convergence Appl. Syst. Innov. 128 1640-undefined
[2]  
Kantaros A(2019)Reliability physics approach for high-density ball grid arrays in autonomousvehicle applications SAE Int. J. Adv. Curr. Pract. Mobil. 2 23-undefined
[3]  
Serebreni M(2020)Experimental and numerical simulation study of the vibration properties of thin copper films bonded to FR4 composite Appl. Sci. 126 41-undefined
[4]  
Sharon G(2014)Determination of mechanical properties of PCB Int. J. Mech. Eng. Robot. Res. 30 400-undefined
[5]  
Blattau N(2004)Temperature dependent deformation analysis of ceramic ball grid array package assembly under accelerated thermal cycling condition J. Electron. Packag. Trans. ASME 143 1-undefined
[6]  
Hillman C(2007)Review of methods to predict solder joint reliability under thermo-mechanical cycling Fatigue Fract. Eng. Mater. Struct. 71 143-undefined
[7]  
Azam SA(2021)State of the art of lead-free solder joint reliability J. Electron. Packag. Trans. ASME 31 26-undefined
[8]  
Fragoso A(2018)Pb-free solder joint thermo-mechanical modeling: state of the art and challenges JOM 19 229-undefined
[9]  
Bhavsar NR(2014)Design for reliability with computer modeling Print. Circuit Des. Fab. undefined undefined-undefined
[10]  
Shinde HP(2010)What is the Young's modulus of silicon? JMEMS undefined undefined-undefined